2_SIGINT_Agency
3_Samsung_Electronics
- An impression and final report for Samsung Electronics Internship
- ISSCC Paper Review: THz Imager by Yokoyama(2019)
- PMC: Power Management IP on CIS utilizing Cyclic ADC
- TMC: Temperature Management on CIS using chopper
- ABBG: Adaptive Body Bias Generator in CIS
- JSSC Paper Study: Rail-to-Rail Op-Amp by Hogervost(1994)
- DBR: Doubler of CIS
- Ramp: Single Slope ADC
- Designing the Reference Block
- ISSCC Paper Review: LiDAR Sensor using TDC/ADC hybrid SoC by Yoshioka(2018)
- EDA tools: Cadence Spectre and HSPICE
- Introduction to CMOS Image Sensor